Wen-wei B. Wu - Publications

In-Situ Transmission Electron Microscope Investigation of the Calcination Behavior and Mechanism of Solid-State Electrolyte Li1.3Al0.3Ti1.7(PO4)3 (LATP).

Journal: Small (Weinheim an der Bergstrasse, Germany)

Published: May 28, 2026

In Situ Transmission Electron Microscopy Observation of Redox-Structure-Coupled Resistive Switching in High-Entropy Oxide Memristors.

Journal: ACS nano

Published: May 15, 2026

Epitaxial Bi2O2Se/Bi2O5Se Thin Films: Revealing Electric-Field-Driven Oxidation and Resistive Switching Dynamics for Advanced Memory Devices.

Journal: Advanced science (Weinheim, Baden-Wurttemberg, Germany)

Published: March 23, 2026

Characterization of Crystallographic Orientation and Void Distribution at Bonding Interfaces of Cu Hybrid Joints by Cut-and-View FIB and EBSD.

Journal: Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada

Published: February 07, 2026

Oral Magnetoelectric Neuroimmunomodulation via the Gut-Brain-Spleen-Heart Axis for Noninvasive Atrial Fibrillation Therapy.

Journal: Advanced materials (Deerfield Beach, Fla.)

Published: August 30, 2025

Synthesis of bimetallic MOFs via interface control using gallium-based liquid metal.

Journal: Nature communications

Published: August 15, 2025

In Situ Atomic-Scale Investigation of Electromigration Behavior in Cu-Cu Joints at High Current Density.

Journal: ACS nano

Published: July 31, 2025

Impact of Oxygen Vacancies in LiCoO2 on the Electrochemical Performance of Garnet-Based All-Solid-State Li-Metal Batteries.

Journal: Advanced science (Weinheim, Baden-Wurttemberg, Germany)

Published: May 14, 2025

Innate Immunity-Guided Macrophage-Homing Nanoplatform for Oral Tumor Immunotherapy and Real-Time Deep-Tissue Imaging in Pre-Clinical Models.

Journal: Advanced materials (Deerfield Beach, Fla.)

Published: April 22, 2025

Dual SOT Switching Modes in a Single Device Geometry for Neuromorphic Computing.

Journal: Nano letters

Published: April 17, 2025

Thermal stability enhancement of low temperature Cu-Cu bonding using metal passivation technology for advanced electronic packaging.

Journal: Communications engineering

Published: April 12, 2025

Titanium Self-Intercalation in Titanium Diselenide Devices: Insights from In Situ Transmission Electron Microscopy.

Journal: Advanced materials (Deerfield Beach, Fla.)

Published: November 27, 2024